The specifications of the new Apple Macbook Pro 16-inch M2 PRO computer

The specifications of the new Apple Macbook Pro 16-inch M2 PRO computer

SanDisk ImageMate AIO card reader Unboxing – USB 3.0 SD Card MicroSD MiniSD SDHC SDXC

This card reader (SanDisk ImageMate All-in-one USB 3.0) capable of reading a variety of camera, camcorder or cell phone/smartphone memory cards. Capable of reading Mini SD, Compact Flash, SDXC, SDHC, UHS-1, Micro SDXC, Micro SDHC cards, with a USB 3.0 interface, it is capable of copying files from the cards to the computer with speeds up to 500 MB/s ( 4 Giga bits/sec). But these speeds are dependent on the class of cards you will be using, and your computer's USB interface. The reader contains 4 card slots, but each slot is capable of reading multiple versions of the type of cards you will be using, or different cards in the same slot. The device uses USB 3.0, but is compatible with USB 2.0, being restricted to the speed capable of this version of the USB interface. Compatible with operating systems Windows XP, Vista, 7, 8, 10, 11, Mac OS 10.4.10+, Linux.

Unboxing

Review

soon...

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Uma publicação partilhada por jomirife (@jomirife)

Smartphone Oppo Reno 4 Z 5G | Unboxing, Specifications, Review, Tests | 8GB . 128GB . 8-core . 48MP . 120Hz . 5G

Smartphone Oppo Reno 4 Z 5G 

8 GB LPDDR4x memory @ 2133MHz

128GB of storage with UFS 2.1 technology

Octa-Core CPU MediaTek Dimensity 800

48 MP camera with 4K video

120 Hz refresh rate

5G wireless network and Wifi 5

4000 mAh battery with 18W fast charging

Fingerprint Sensor and Facial recognition to unlock

and much more...

Unboxing

Specifications and features

Review

soon

Tests

soon

Photos

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Uma publicação partilhada por jomirife (@jomirife)

Microsoft Surface Pro 7 specifications and technology

Microsoft Surface Pro 7 

Screen: Touchscreen PixelSense 12,3"
Resolution: 2736x1824 (267 PPP)
Processor: Intel i7-1065G7 10th gen Quad-core
Memory: 16 GB LPDDR4x RAM
Storage: 1 TB SSD
Sensors: Ambient light sensor, accelerometer, gyroscope, magnetometer.
Connections: USB-C, USB-A, headphones 3.5mm, Surface Connect, MicroSDXC card reader.
Connectivity: Wi-Fi6 802.11ax, Bluetooth 5.0
Camera: 8MP Full HD 1080p, 5MP front camera 

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Uma publicação partilhada por Jorge Ribeiro (@jomirife)

Raspberry Pi Compute Module 4 Review and Specifications

Related: Raspberry Pi comparison • Pi 4 model B • Compute Module 4

The power of Raspberry Pi 4 in a compact form factor for deeply embedded applications. Raspberry Pi Compute Module 4 incorporates a quad-core ARM Cortex-A72 processor, dual video output, and a wide selection of other interfaces. Available in 32 variants, with a range of RAM and eMMC Flash options, and with or without wireless connectivity.

Specifications:
• Broadcom BCM2711 quad-core Cortex-A72 (ARM v8) 64-bit SoC @ 1.5GHz
• H.265 (HEVC) (up to 4Kp60 decode), H.264 (up to 1080p60 decode, 1080p30 encode)
• OpenGL ES 3.0 graphics
• Options for 1GB, 2GB, 4GB or 8GB LPDDR4-3200 SDRAM (depending on variant)
• Options for 0GB ("Lite"), 8GB, 16GB or 32GB eMMC Flash memory (depending on variant)
• Option for fully certified radio module: 2.4 GHz, 5.0 GHz IEEE 802.11 b/g/n/ac wireless; Bluetooth 5.0, BLE; On-board electronic switch to select either external or PCB trace antenna

Documents:
Raspberry Pi Compute Module 4 product brief
Raspberry Pi Compute Module 4 datasheet

Apple iPhone 12 Pro Max Mini – 6.7 inch screen, 2778x1284 resolution, 12MP camera, A14 Bionic (6-core CPU, 4-core GPU), LiDAR

Model	iPhone 12 Pro
Storage	512GB, 256GB, 128GB
Display	Super Retina XDR display 6.7 inch all-screen OLED HDR display 2,000,000:1 contrast ratio 2778x1284 (3.5 million) pixels @ 458ppi
Chip	A14 Bionic chip with 64-bit architecture 6 core CPU 4 core GPU 5nm process technology 11.8 billion transistors 16 core Neural Engine (11 trillion OPs) Machine Learning (ML) Accelerators Image Signal Processor (ISP)
Back camera	Triple-camera Ultra Wide 12MP: f/2.4 apertura, 5-element lens, 13nm focal length, 120º field of view, LiDAR scanner Wide 12MP: f/1.6 apertura, 7-element lens, 26nm focal length, Optical image stabilization, Focus Pixels Telephone 12MP: f/2.0 apertura, 6-element lens, 52nm focal length, 4x optical zoom range, Optical image stabilization, Focus Pixels Night mode timel-apse HDR Video Recording (10-bit HDR, 700 million colors)
Connectivity	5G Ultra Wideband USB-C
Price	$999

Model	iPhone 12
Storage	512GB, 256GB, 128GB
Display	Super Retina XDR display 6.1 inch all-screen OLED HDR display 2,000,000:1 contrast ratio 2532x1170 (2.8 million) pixels @ 460ppi
Chip	A14 Bionic chip with 64-bit architecture 6 core CPU 4 core GPU 5nm process technology 11.8 billion transistors 16 core Neural Engine (11 trillion OPs) Machine Learning (ML) Accelerators
Back camera	Dual-camera Ultra Wide 12MP: f/2.4 apertura, 5-element lens, 13nm focal length, 120º field of view, night mode Wide 12MP: f/1.6 apertura, 7-element lens, 26nm focal length, optical image stabilization, night mode Night mode timel-apse
Connectivity	5G Ultra Wideband USB-C
Price	$799

Model	iPhone 12 Mini
Storage	512GB, 256GB, 128GB
Display	Super Retina XDR display 5.4 inch all-screen OLED HDR display 2,000,000:1 contrast ratio 2340x1080 (2.5 million) pixels @ 476ppi
Chip	A14 Bionic chip with 64-bit architecture 6 core CPU 4 core GPU 5nm process technology 11.8 billion transistors 16 core Neural Engine (11 trillion OPs) Machine Learning (ML) Accelerators
Back camera	Dual-camera Ultra Wide 12MP: f/2.4 apertura, 5-element lens, 13nm focal length, 120º field of view, night mode Wide 12MP: f/1.6 apertura, 7-element lens, 26nm focal length, optical image stabilization, night mode Night mode timel-apse
Connectivity	5G Ultra Wideband USB-C
Price	$699

PlayStation 5 teardown: An up-close look at the console interior hardware

Do not try this at home. Risk of exposure to laser radiation, electric shock, or other injury. Disassembling your PS5 console will invalidate your manufacturer’s guarantee.

Minisforum EliteMini H31G Mini PC Workstation Computer Review

Specs

CPU: Intel i7-9700F, Intel i7-9100F, Intel i5-9500F, Intel i5-9400F, Intel i3-9300F

GPU: GTX 1050 Ti 4GB

Storage: 512 GB SSD, 256GB SSD

Memory: 8-16GB DDR4 RAM @ 2400Mhz

Communication: Wi-Fi 6 & Bluetooth 5.1

Microsoft Xbox Series X and Series S specs and features | CPU, GPU, Memory, Storage, IO, Audio, Video, Dimensions, Weight

Related articles: PlayStation 5 specs • Xbox Series X specs • Playstation VR • PS5 vs Xbox X • PS4 vs Xbox One • Evolution of Game Consoles 

 Microsoft Xbox Series X (2020)

Component	Specification
Processor	8x Cores @ 3.8 GHz (3.66 GHz w/ SMT) Custom Zen 2 CPU
Graphics	12.155 TFLOPS, 52 CUs @ 1.825 GHz Custom RDNA 2 GPU
Die Size	360.45 mm2
Process	7nm Enhanced
Memory	16 GB GDDR6 w/ 320mb bus
Memory Bandwidth	10 GB @ 560 GB/s, 6GB @ 336 GB/s
Internal Storage	1 TB Custom NVME SSD
I/O Throughput	2.4 GB/s (Raw), 4.8 GB/s (Compressed, with custom hardware decompression block)
Expandable Storage	1 TB Expansion Card (matches internal storage exactly)
External Storage	USB 3.2 External HDD Support
Optical Drive	4K UHD Blu-Ray Drive
Performance Target	4K @ 60 FPS, up to 4K @ 120 FPS, 8K @ 60 FPS
Color	Matte Black
Size	301mm x 151mm x 151mm
Release date	Holiday 2020

Microsoft Xbox Series S (2020)

Component	Specification
Processor	8x Cores @ 3.6 GHz (3.4 GHz w/ SMT) Custom Zen 2 CPU
Graphics	4 TFLOPS, 20 CUs @ 1.565 GHz Custom RDNA 2 GPU
Memory	10 GB GDDR6
Memory Bandwidth	8 GB @ 224 GB/s, 2GB @ 56 GB/s
Internal Storage	512 GB Custom NVME SSD
I/O Throughput	2.4 GB/s uncompressed, 4.8 GB/s compressed
Expandable Storage	1 TB Expansion Card (matches internal storage exactly)
External Storage	USB 3.2 External HDD Support
Optical Drive	None, digital-only
Performance Target	1440p @ 60 FPS, up to 120 FPS
Color	Robot White, Black
Dimensions	Unknown (60% smaller than Xbox Series X)
Price	$299, £249, €299
Release date	November 10, 2020

Sony Playstation 5 specs and features | CPU, GPU, Memory, Storage, IO, Audio, Video, Dimensions, Weight

Related articles: PlayStation 5 specs • Xbox Series X specs • Playstation VR • PS5 vs Xbox X • PS4 vs Xbox One • Evolution of Game Consoles 

Component	Specification
CPU	x86-64-AMD Ryzen Zen 8 Cores / 16 Threads at 3.5GHz (variable frequency)
GPU	Ray Tracing Acceleration Up to 2.23 GHz (10.3 TFLOPS)
GPU Architecture	AMD Radeon RDNA 2-based graphics engine
Memory/Interface	16GB GDDR6/256-bit
Memory Bandwidth	448GB/s
Internal Storage	Custom 825GB SSD
IO Throughput	5.5GB/s (Raw), Typical 8-9GB/s (Compressed)
Expandable Storage	NVMe SSD Slot
External Storage	USB HDD Support
Optical Drive (optional)	Ultra HD Blu-ray (66G/100G) ~10xCAV BD-ROM (25G/50G) ~8xCAV BD-R/RE (25G/50G) ~8x CAV DVD ~3.2xCLV
PS5 Game Disc	Ultra HD Blu-ray, up to 100GB/disc
Audio	"Tempest" 3D AudioTech
Video Out	HDMI Out port Support of 4K 120Hz TVs, VRR (specified by HDMI ver 2.1)
Dimensions	PS5 - 390mm x 104mm x 260mm (width x height x depth) PS5 Digital Edition - 390mm x 92mm x 260mm (width x height x depth)
Weight	PS5 - 4.5kg PS5 Digital Edition - 3.9kg
Power	PS5 - 350W PS5 Digital Edition - 340W
Input / Output	USB Type-A port (Hi-Speed USB) USB Type-A port (Super Speed USB 10Gbps) x2 USB Type-C port (Super Speed USB 10Gbps)
Networking	Ethernet (10BASE-T, 100BASE-TX, 1000BASE-T) IEEE 802.11 a/b/g/n/ac/ax Bluetooth 5.1